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사업영역

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사업소개


  • Temporary Wafer Bonding System 
  • Wafer De-bonding System 
  • Wafer Transfer System (Vacuum Cluster System, EFEM, Robot, LPM) 



  • Chip Transfer System
  • Aligner & Pre-bonder
  • Thermal Eutectic Bonder
  • Laser Eutectic Bonder
  • OCA/OCR Bonding System
  • Pol Lamination & Auto Clave System 
  • EFEM(Mask/Wafer) 


코스텍시스템(주) 경기도 평택시 서탄면 방꼬지길 231

TEL : 031-646-1500  FAX : 031-646-1515

Email : Sales@kosteks.com

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