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Wafer De-Bonding System

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Wafer Bonding System


์ œํ’ˆ์†Œ๊ฐœ


Wafer De-Bonding System

Fan-out Wafer/Panel Level Packaging์—์„œ Molding ์‹œ์— ์ƒ๊ธด Warpage ๋ฅผ  ํŽด ์ฃผ๊ธฐ ์œ„ํ•ด ํ›„๋ฉด์— ์ž„์‹œ ์ ‘ํ•ฉํ•œ Carrier Wafer๋ฅผ Mold Wafer ์ „๋ฉด์— ๋ฐฐ์„  ๋ฐ Bumping ๊ณต์ •์„ ๋งˆ์นœ ํ›„ ๋ถ„๋ฆฌ/์ œ๊ฑฐํ•˜๋Š” ์‹œ์Šคํ…œ์ž…๋‹ˆ๋‹ค.


๋˜ํ•œ ๋ฐ˜๋„์ฒด ์ ์ธต์„ ํ•˜๊ธฐ ์œ„ํ•œ TSV ๊ณต์ •์—์„œ Device Wafer์˜ ํ›„๋ฉด์„ Back grindingํ•˜๊ณ  ๋ฐฐ์„  ๋ฐ  Bumping ๊ณต์ •์„ ๋งˆ์นœ ํ›„, ์ž„์‹œ๋กœ ์ ‘ํ•ฉ๋œ Carrier Wafer๋ฅผ Thinned Device Wafer๋กœ๋ถ€ํ„ฐ ๋ถ„๋ฆฌํ•˜๋Š”๋ฐ ์‚ฌ์šฉ๋ฉ๋‹ˆ๋‹ค. Device Wafer ํ›„๋ฉด์„ Back grindingํ•˜์—ฌ ์ดˆ๋ฐ•ํ˜•์ด ๋œ ๊ฒฝ์šฐ์—๋Š” Ring Frame์—  Mounting ํ•˜์—ฌ ๋ฐ•๋ฆฌ๋ฅผ ํ•ฉ๋‹ˆ๋‹ค. 


 ์ด ๋•Œ, Carrier Wafer๋ฅผ Device Wafer(Mold Wafer/Panel)๋กœ๋ถ€ํ„ฐ ๋ถ„๋ฆฌํ•˜๋Š” ๋ฐฉ์‹์œผ๋กœ Laser, ์ผ€๋ฏธ์ปฌ ๋˜๋Š” ๊ธฐ๊ณ„์  ๋ฐฉ๋ฒ•์ด ์žˆ์Šต๋‹ˆ๋‹ค.

  Features

  • De-bonding method : Laser, UV, Mechanical 3 types available
  • De-bonding module and De-lamination module included
  • Crack and chipping free during de-bonding
  • FOWLP / FOPLP and TSV process available
  • The System composed with optimizing module for De-bonding process

  Specifications

  • Laser : IR Fiber CW (1064nm, 50W), DPSS UV (355nm, 30W)
  • Wafer Size: up to 12” / โ–ก 300mmx300mm
  • Warpage handling : ≤ 10mm
  • UPEH (Depending on material’s property) : ≥20 wafers/h


์ฝ”์Šคํ…์‹œ์Šคํ…œ(์ฃผ) ๊ฒฝ๊ธฐ๋„ ํ‰ํƒ์‹œ ์„œํƒ„๋ฉด ๋ฐฉ๊ผฌ์ง€๊ธธ 231

TEL : 031-646-1500  FAX : 031-646-1515

Email : Sales@kosteks.com

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