Pre-Aligner

Semiconductor Equipment

Item	Specification
Handling Object	200 ~ 300 mm SEMI standard Silicon wafer (orientation flat, notch)
Processing time	2.5 seconds or less (when processing 300mm)
Alignment accuracy	XY=±0.1mm or less T=±0.1°or less
Wafer off-center limit	±5mm or less (wafer offset from chuck center)
Wafer holding method	Backside vacuum chuck (55 mm)
Alignment sensor	Edge detection by line sensor to discriminate light intensity
Power source	24V DC±10%, 5A, 1-line
Vacuum	-80KPa or less, 1-line
Weight	Approx. 12kg

Item	Specification
Handling Object	200 & 300 mm SEMI standard Silicon wafer
Processing time	8 seconds or less (when processing 300mm)
Alignment accuracy	±0.2°or less
Wafer holding method	Wafer-edge partial gripping
Wafer contact material	PEEK
Control system	Command control through RS-232C interface
Power source	24V DC±10%, 3A, 1-line
Dry air	6-mm tubing, 0.35-0.4MPa, 10 liters/min or more
Weight	Approx. 8kg