Features

• 3 Bonding chambers and 1 Spin Coating (or Film laminating) module according to bonding process
• Bonding System using Optical Clear Adhesive(OCA/OCR)
• Bonding module using Vision Align Camera to achieve  precise alignment
• Automatic Adjustment of Lower and Upper Chucks Parallelism by Control Unit
• Damage free through uniform pressing
• Rigid (or Flexible) to Rigid OCA bonding available

  Specifications

• Substrate Size : Φ300mm
• Optical Alignment Accuracy : ≤ ±1µm
• Total Thickness Variation : ≤ ±3µm
• Void/Particle Free after bonding in Vacuum
• Panel Damage Free after bonding