Wafer De-Bonding System

Home  >  제품소개  >  Semiconductor Equipment > Wafer Bonding System  >  Wafer De-bonding System > More 

Wafer Bonding System

Wafer De-Bonding System

Wafer De-bonding System은 Modular type으로 Laser Module 숫자를 증가시켜서 Throughput을 향상시킬 수 있습니다. Spin Cleaning Module은 고객사의 요청에 따라 구성 또는 제외할 수 있습니다.

 Laser De-bonding Process Flow

 De-bonding Process Flow

  1. Mechanical type :

  2. UV/Laser dissolution type :

 Results of  De-bonding Process

  1. Results of  Laser Irradiation :

Adopting flat-top function to reduce device damage

  2. Results of  Spin Cleaning :

Residue and crack free of the device wafer

 Handling of Warped Wafer

  1. Allowable warpage level after debonding :


  • Allowable Warpage :  ~ 10mm
  • 12” Circle and 300x300mm Square Substrate

Wafer Warpage can be spread out by a special designed Vacuum Chuck.

  2. Preventing of Bump Surface Damage :

Bump Damage  free by using a special designed Vacuum Pad

 Laser Module for De-bonding System


  • Laser source : CW Fiber Laser(1064nm), Excimer laser(308nm), DPSS UV laser(355nm)
  • Removal of adhesion force of LTHC(Light To Heat Conversion) layer by Laser irradiation
  • Flat-top function adopted for the reduction of device damage


 De-bonding Process Flow (Fan-out Panel Level Packaging) 

코스텍시스템(주) 경기도 평택시 서탄면 방꼬지길 231

TEL : 031-646-1500  FAX : 031-646-1515

Email : Sales@kosteks.com

© 2022 KOSTEK SYSTEMS, INC. All Rights Reserved.