Wafer De-Bonding System

Wafer De-bonding System은 Modular type으로 Laser Module 숫자를 증가시켜서 Throughput을 향상시킬 수 있습니다. Spin Cleaning Module은 고객사의 요청에 따라 구성 또는 제외할 수 있습니다.

 Laser De-bonding Process Flow

 De-bonding Process Flow

  1. Mechanical type :

  2. UV/Laser dissolution type :

 Results of  De-bonding Process

  1. Results of  Laser Irradiation :

Adopting flat-top function to reduce device damage

  2. Results of  Spin Cleaning :

Residue and crack free of the device wafer

 Handling of Warped Wafer

  1. Allowable warpage level after debonding :

Wafer Warpage can be spread out by a special designed Vacuum Chuck.

  2. Preventing of Bump Surface Damage :

Bump Damage  free by using a special designed Vacuum Pad

 Laser Module for De-bonding System

  Features

• Laser source : CW Fiber Laser(1064nm), Excimer laser(308nm), DPSS UV laser(355nm)
• Removal of adhesion force of LTHC(Light To Heat Conversion) layer by Laser irradiation
• Flat-top function adopted for the reduction of device damage

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 De-bonding Process Flow (Fan-out Panel Level Packaging)