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Semiconductor Equipment |
Temporary Wafer Bonding System
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Wafer Bonding System |
Temporary Wafer Bonding System은 Bonding Module 숫자를 증가시켜서 Throughput을 향상시킬 수 있습니다. 임시접착제가 Glue인 경우에는 Spin Coater와 Soft Curing 장치가 구성되고, 임시접착제가 Film Type인 경우는 Lamination module로 대체하면 Wafer Bonding System이 됩니다.
Temporary Bonding Process Flow : Glue / Film Adhesive
1. Glue type Adhesive
2. Film type Adhesive
Fan-out WLP Bonding Process Flow : Glue Adhesive
Fan-out WLP Bonding Process Flow : Film Adhesive
Fan-out PLP Bonding Process Flow : Film type Adhesive
코스텍시스템(주) 경기도 평택시 서탄면 방꼬지길 231
TEL : 031-646-1500 FAX : 031-646-1515
Email : Sales@kosteks.com
© 2022 KOSTEK SYSTEMS, INC. All Rights Reserved.
코스텍시스템(주) 대표이사 : 배준호 주소 : 경기도 평택시 서탄면 방꼬지길 231
TEL : 031-646-1500 FAX : 031-646-1515 Email : Sales@kosteks.com
© 2022 KOSTEK SYSTEMS, INC. All Rights Reserved.