Fan-out Packaging Process with TB DB 

  The Processes available by TB DB    

1. Adhesive film Lamination
2. Carrier Wafer Bonding
3. Square Carrier Removal
4. Carrier Wafer De-bonding/Adhesive film Peel off

     *TB DB: Temporary Wafer Bonder & De-bonder

TSV(HBM) Process Flow with TB DB     

  The Processes available by TB DB     

1. Adhesive Spin coating / Lamination
2. Carrier Wafer Temporary Bonding
3. Carrier Wafer De-bonding

     *TB DB: Temporary Wafer Bonder & De-bonder

Bonding & De-bonding 공정의 필요성    

  1. Fan-out WLP  

  2. TSV  

• Carrier Bonding => Device Wafer Back grinding 과 Mold Wafer Warpage 방지  및  Post Process 목적
• Post Process에서 내열성, 내화학성 기능 및 본딩 유지