Wafer Bonding System

Home  >  제품소개  >  Semiconductor Equipment  >  Wafer Bonding System > More


Wafer Bonding System

Fan-out Packaging Process with TB DB 

  The Processes available by TB DB    

  1. Adhesive film Lamination
  2. Carrier Wafer Bonding
  3. Square Carrier Removal
  4. Carrier Wafer De-bonding/Adhesive film Peel off

     *TB DB: Temporary Wafer Bonder & De-bonder

TSV(HBM) Process Flow with TB DB     

  The Processes available by TB DB     

  1. Adhesive Spin coating / Lamination
  2. Carrier Wafer Temporary Bonding
  3. Carrier Wafer De-bonding

     *TB DB: Temporary Wafer Bonder & De-bonder

Bonding & De-bonding 공정의 필요성    

  1. Fan-out WLP  

  2. TSV  

  • Carrier Bonding => Device Wafer Back grinding 과 Mold Wafer Warpage 방지  및  Post Process 목적
  • Post Process에서 내열성, 내화학성 기능 및 본딩 유지

코스텍시스템(주) 경기도 평택시 서탄면 방꼬지길 231

TEL : 031-646-1500  FAX : 031-646-1515

Email : Sales@kosteks.com

© 2022 KOSTEK SYSTEMS, INC. All Rights Reserved.