Features

• Experience in Bonding & Lamination Process for Semiconductor(TSV, FOWLP) Wafer handling
• Pol Film Lamination and Auto Clave 일체형 설비
• Lamination module using Roll to Roll unit

  Specifications 

• Substrate Size : Φ300mm
• Film Cutting Accuracy : ≤ ±20㎛
• Film Lamination Accuracy : ≤ ±50㎛
• Autoclave Pressure : max. 10Bar
• Autoclave Temperature : max. 150℃ ± 2%
• Void Free : @>1 µm